| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition capable of giving excellent flame retardancy to a cured material thereof and capable of improving reliability of an electronic part sealed device, when used for producing the electronic part sealed device. SOLUTION: This sealing resin composition contains (A) an epoxy resin expressed by chemical formula (1) [R is a monovalent group expressed by chemical formula (2) (R<SP>1</SP>and R<SP>2</SP>are each H or an alkyl; and X is a bivalent atom or a bivalent organic group)], (B) a phenolic resin, and (C) an inorganic filler as essential components, wherein the inorganic filler (C) is contained in a ratio of not less than 60 wt% and not more than 90 wt% based on a total amount of the sealing resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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