发明名称 CURABLE TRIAZINE COMPOSITION FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING THE SAME AND CURED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a triazine composition containing a compound curable with heat or light and having a sealing material for electronic components or a varnish for the electronic components affording a cured product having excellent heat and tinning resistances as applications and to provide a method for producing the composition. SOLUTION: The curable triazine composition is characterized as comprising (A) a triazine compound represented by general formula (1) [äwherein, R<SB>1</SB>s denote each independently a bivalent organic group; X<SP>1</SP>s denote each independently a monovalent organic group; X<SP>2</SP>s denote each an oxygen atom, a sulfur atom or a group represented by general formula (2) (wherein, R<SP>2</SP>denotes a hydrogen atom, a 1-12C alkyl group, an aryl group or an aralkyl group); and n denotes an integer of 2-100}; in which a part or all of the existing n X<SP>1</SP>s have each a curable group curable with heat or light]. The curable triazine composition has a sealing material for the electronic components and/or the varnish for the electronic components as the applications. The method for producing the composition and a cured product thereof are provided. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006070248(A) 申请公布日期 2006.03.16
申请号 JP20050214071 申请日期 2005.07.25
申请人 SHOWA DENKO KK 发明人 UCHIDA HIROSHI;SEKI KENTARO;SAKATA YUKO
分类号 C08G75/00;C08K3/00;C08L81/00;H05K3/28 主分类号 C08G75/00
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