发明名称 |
Herstellungsverfahren für einen Halbleiterchip |
摘要 |
The present invention relates to a semiconductor device, and more particularly to a structure of a semiconductor wafer and a fabrication method of semiconductor chips. According to the present invention, a semiconductor wafer containing a plurality of semiconductor chip portions has a plurality of chip scribe lanes formed between the semiconductor chip portions. A plurality of chip bonding pads are formed on the semiconductor chip portions of the wafer, and a plurality of wafer probing pads are formed on the chip scribe lanes. The wafer probing pads are electrically connected to internal circuits of the semiconductor chip portions and/or to corresponding ones of the chip bonding pads. |
申请公布号 |
DE19835840(B4) |
申请公布日期 |
2006.03.16 |
申请号 |
DE1998135840 |
申请日期 |
1998.08.07 |
申请人 |
LG SEMICON CO., LTD. |
发明人 |
KIM, JAE WOON;PARK, JONG HOON |
分类号 |
H01L21/66;H01L21/78;H01L21/60;H01L23/485;H01L23/50;H01L23/528;H01L23/58 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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