Electronic component e.g. dynamic RAM, has Peltier component with two structural units having different Peltier coefficients, where region between units provided along semiconductor module periphery is cooled as current flows between units

摘要

The component has a semiconductor module and a cooling device (5) with a Peltier component (3) including two structural units (11, 12) having different Peltier coefficients. One structural unit is made of n-doped semiconductor and the other is made of p-doped semiconductor. A region between the units is cooled when a current flows between the units, where the region is provided along the periphery of the semiconductor module.