| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide wire bonding method and wire bonding device for permitting long life wire bonding by optimizing the shape of loop of a wire to reduce a strain generated in the wire since the strain generated in the wire depends on the shape of loop of the wire. <P>SOLUTION: A relation between the strain generated in the wire bonding and the shape of loop of the same is formalized through a function to optimize the shape of loop of the wire bonding so that the strain generated in the wire becomes lower than a predetermined prescribed value. In addition, the life of wire is estimated from the fatigue-life curve of wire, and is programmed so as to obtain the shape of loop which satisfies an objective life. Further, this program is incorporated into the wire bonding device whereby the bonding can be effected automatically through the shape of loop which minimizes the strain in the wire. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
