| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing work efficiency, and to prevent lowering of polishing flatness caused by air catching regarding a workpiece holding member used for precision surface polishing of an interlayer insulating film and metal wiring of a semiconductor wafer, LCD glass and a semiconductor device. <P>SOLUTION: This workpiece holding member 10 is provided with a base sheet 12, a backing material 13 fixed on the base sheet 12, and a template 14 fixed on the base sheet 12 on an outer periphery of the backing material 13; and a workpiece 16 to be polished is arranged inside the template 14, and is fixed by the backing material 13 so as to be held. The base sheet 12 is air-permeable, and a thickness D is 0.2 to 2.0 mm. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
