| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric film actuator insusceptible to thermal process in which a vibrating plate exhibits good controllability in thickness without employing an SOI wafer, and to provide its fabrication process. <P>SOLUTION: The piezoelectric film actuator is fabricated through a process for forming a pressure generating means and a vibrating plate structure on an intermediate transfer body, a process for bonding the pressure generating means and the vibrating plate structure on the intermediate transfer body to a second substrate, and a process for stripping the intermediate transfer body from the pressure generating means and the vibrating plate structure. The intermediate transfer body is a silicon substrate, or it is a silicon substrate having a porous layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
