发明名称 |
Methods for forming conductive bumps and wire loops |
摘要 |
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive bump. The method also includes moving the bonding tool to contact the conductive bump such that a location of the junction is moved with respect to the bonding location.
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申请公布号 |
US2006054665(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20050222300 |
申请日期 |
2005.09.08 |
申请人 |
KULICKE AND SOFFA INDUSTRIES INC. |
发明人 |
CALPITO DODGIE R.M.;BABINETZ STEPHEN |
分类号 |
B23K31/00 |
主分类号 |
B23K31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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