发明名称 ELECTRONIC PART AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic part having a small contact resistance and to provide a method of manufacturing the same. <P>SOLUTION: The electronic part includes lower layer metal wiring 4, an interlayer insulating film 6 formed on the lower layer metal wiring 4, and upper layer metal wiring 7 formed on the interlayer insulating film 6 and electrically connected to the lower layer metal wiring 4 via a through hole 5 formed in the interlayer insulating film 6. The lower layer metal wiring 4 is made by diffusing at least a first metal and a second metal. The first metal has a large standard forming free energy of the oxide from the second metal. The second metal has a higher reflecting rate at least at one point of the beam having a wavelength of 350-440 nm than the first metal, and has a close contact layer 7 formed of a metal having smaller standard forming energy of the oxide than the first metal between an upper layer metal wiring 8 and the lower layer metal wiring 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006074223(A) 申请公布日期 2006.03.16
申请号 JP20040252892 申请日期 2004.08.31
申请人 MURATA MFG CO LTD 发明人 TAMURA TAKESHI
分类号 H03H9/25;H01L21/768;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H01L41/29;H03H3/08 主分类号 H03H9/25
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