| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection material for satisfying requirements of high temperature conductivity, high adhesiveness and an environment harmony type in the connection material for electric and thermal connection. <P>SOLUTION: In the connection material, metal particulate which has a surface coated with an organic protection film and whose particle diameter is 1 to 100nm is bonded onto at least one surface of metal foil. In a composite sheet material, a metal material is evaporated by using an evaporation device and it is cooled in organic protection film material steam. Thus, the metal particulate where the organic protection film is formed on the surface is formed, and it is bonded to the surface of metal foil so as to form the material, or dispersion solution containing metal particulate on which the organic protection film is formed in the surface is applied on the surface of metal foil and it is dried so as to obtain the material. The material is suitable as a die mounting material of the semiconductor apparatus. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
