| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which prevents a break of a resin package. <P>SOLUTION: The semiconductor light emitting device 1 comprises a pair of terminals 6 to 9 formed on both sides on the surface of an insulating substrate 2, a pair of wiring parts 10, 11 formed at the intermediate part on the surface respectively connected to both the terminals 6 to 9 through connecting parts 17 to 20, wiring parts 10, 11 connected to the semiconductor light emitting elements 3, 4, respectively, a resin package 5 covering the wiring parts 10, 11 and the semiconductor light emitting elements 3, 4, and resin resist layers 25, 26 convering the connecting parts 17 to 20. A gap formed of notches 21 to 24 formed adjacent to the connecting parts 17 to 20 of the terminals 6 to 9 of the semiconductor device 1 between the terminals 6 to 9 and the wiring parts 10, 11 prevents the penetration of solder into wirings 10, 11 even though positions of the resin resist layers 25, 26 are out of alignment. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
