发明名称 PACKAGE FOR HOUSING ELECTRIC ELEMENT, ELECTRIC ELEMENT UNIT AND ELECTRIC ELEMENT COOLING MODULE
摘要 PROBLEM TO BE SOLVED: To provide a package for housing an electric element which has a high heat sink property and reliability and can use liquid having conductivity as liquid for cooling, and to provide an electric element unit and an electric element cooling module. SOLUTION: The package 14 for housing the electric element includes an electric element storing container 16 for housing the electric element 15 which is formed into an approximately rectangular parallelepiped shape and in which a part except the upper surface 16a is formed into a watertight structure, and an electrode 17 arranged on the inner surface of this electric storing container 16. At least the part of a member for constituting the external surface of the electric element storing container 16 in contact with the liquid 11 for cooling is made of a ceramic substrate of 10 kV/mm or more of a withstand voltage. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006073658(A) 申请公布日期 2006.03.16
申请号 JP20040253230 申请日期 2004.08.31
申请人 KYOCERA CORP 发明人 TERASONO HIROBUMI;TERAO SHINYA;YOSHIHARA YASUHIKO
分类号 H01L23/34 主分类号 H01L23/34
代理机构 代理人
主权项
地址