发明名称 Method and apparatus for characterizing a recess located on a surface of a substrate
摘要 Method and apparatus for characterizing a recess located on a surface of a substrate are provided. One embodiment of the invention provides a method for characterizing a recess located on a surface of a substrate. In a first step, a measurement tip is positioned directly above the recess. Subsequently, an electrically conductive path is provided between the measurement tip and the bottom of the recess by ionizing a medium located in the recess. A voltage is applied between the measurement tip and the substrate to measure a current flowing between the measurement tip and the bottom of the recess. The recess is characterized on the basis of the magnitude of the measured current. Another embodiment of the invention provides an apparatus for performing the method for characterizing a recess.
申请公布号 US2006054812(A1) 申请公布日期 2006.03.16
申请号 US20040940490 申请日期 2004.09.14
申请人 KUNDALGURKI SRIVATSA 发明人 KUNDALGURKI SRIVATSA
分类号 G01N23/00 主分类号 G01N23/00
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