| 摘要 |
An assembly (100) is provided comprising a first chip (20) and a second chip (30) which are interconnected through solder connections. These comprise, at the first chip, an underbump metallisation and a solder bump, and, at the second chip, a metallisation. In this case the solder bump is provided as a fluid layer with a contact angle of less than 90 <sup |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;VAN VEEN, NICOLAAS, J., A.;HOCHSTENBACH, HENDRIK, P. |
发明人 |
VAN VEEN, NICOLAAS, J., A.;HOCHSTENBACH, HENDRIK, P. |
