| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimidebenzoxazole film in which all of heat resistance, a property corresponding to high frequency and flexibility are satisfied in a high level. SOLUTION: The polyimidebenzoxazole film contains a polyimidebenzoxazole obtained by reacting aromatic diamines having a benzoxazole structure with aromatic tetracarboxylic anhydrides as a main component and has 1.47-1.55 g/cm<SP>3</SP>density. The polyimidebenzoxazole film has, preferably, 0.79-0.89 face orientation index of the film measured in X ray diffraction method and 2.7-3.1 relative dielectric constant at 1GHz measured by cavity resonance perturbation method and 2.6-3.0 relative dielectric constant at 100 GHz. COPYRIGHT: (C)2006,JPO&NCIPI |
