| 摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition system and a vapor deposition method for uniformizing the thickness of a vapor-deposited film. SOLUTION: The vapor deposition system 30 is provided with: a vapor deposition chamber 31 for storing a front substrate 2; and an evacuation device 32 for evacuating the inside of the vapor deposition chamber 32. In the vapor deposition chamber 31, a crucible 37 confronted with the face 2a to be vapor-deposited in the front substrate 2, and a plurality of rods 40 located between the front substrate and the crucible and composing a plurality of slits 41 are arranged. COPYRIGHT: (C)2006,JPO&NCIPI
|
