| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor fabrication equipment where routine cleaning for a clamping mechanism is not needed. SOLUTION: A plating device is provided with: a clamping mechanism 11 for holding a wafer 10; a plating tank 21 for storing a plating liquid 22; a rotating mechanism 20 for rotating the clamping mechanism 11; a nozzle 26 for injecting pure water 27 to the wafer 10 subjected to plating treatment; a nozzle 29 for injecting pure water 30 to the clamping mechanism 11; and a nozzle 31 for injecting N<SB>2</SB>32 to the clamping mechanism 11. COPYRIGHT: (C)2006,JPO&NCIPI
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