发明名称 |
Method of Manufacturing Double-Sided Printed Circuit Board |
摘要 |
The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.
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申请公布号 |
US2006054588(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20050160067 |
申请日期 |
2005.06.07 |
申请人 |
HSU HUNG-EN;WANG BINWEI;HO SHING-FUN |
发明人 |
HSU HUNG-EN;WANG BINWEI;HO SHING-FUN |
分类号 |
H01B13/00;C23F1/00;H05K3/02 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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