| 发明名称 |
Process for joining a base material using a solder for forming a workpiece comprises applying dust particles of specified particle size to the base material and fusing forming a solder and obtaining the workpiece |
| 摘要 |
<p>Process for joining a base material using a solder for forming a workpiece comprises applying dust particles of particle size less than 1 mu m to the base material and fusing, forming a solder and obtaining the workpiece.</p> |
| 申请公布号 |
DE102004034815(A1) |
申请公布日期 |
2006.03.16 |
| 申请号 |
DE20041034815 |
申请日期 |
2004.07.19 |
| 申请人 |
BEHR GMBH & CO. KG |
发明人 |
BOGER, SNJEZANA;ENGLERT, PETER;PFITZER, MATTHIAS;TRAUTWEIN, INGO;TUERPE, MATTHIAS |
| 分类号 |
B23K1/20 |
主分类号 |
B23K1/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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