| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier for polishing capable of preventing an occurrence of damages on an end face of a substrate when polishing a brittle and highly cleavable single crystal silicon substrate, and hardly generating dust by rubbing with a cassette at the time of housing the carrier in the cassette in a later process, and further to provide a manufacturing method of a silicon substrate using this carrier for polishing and the silicon substrate. <P>SOLUTION: A part brought into contact with a silicon substrate of an inner peripheral part of a substrate holding hole of a carrier for polishing is constituted by a cushion material having lower hardness than the silicon substrate. As the cushion material, any one selected from suede, polyamide resin, polypropylene resin, or epoxy resin can be used, and particularly the epoxy resin can be preferably used. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
