| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a substrate capable of dealing with requirements of miniaturization and thinning of a semiconductor package and of enough securing flatness of the mounting surface of a semiconductor element. <P>SOLUTION: The manufacturing method of a substrate equipped with a plurality of mutually independent terminal electrodes forms a solder resist 2 on the surface of a holding sheet 1 such as a polyethylene tape or the like, and forms an opening part in the solder resist using a photolithography technique and an etching technique, and further formes terminal electrodes 5 such that a catalyst is applied on the formation region of the opening part, and the connection surface of the semiconductor element is directed to the side of the holding sheet by an electroless plating technique. Thereafter, the holding sheet is removed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
