| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a rear surface irradiation type solid-state imaging element color separation of pixels without use of any color filter, and also to provide a camera module and an electronic equipment module both equipped with the solid-state imaging element. <P>SOLUTION: The solid-state imaging element is configured in such a way that a photoelectric conversion element PD is formed on a semiconductor substrate 22, means for reading signal electric charges from the photoelectric conversion element PD is formed on one surface side of the semiconductor substrate 22, and also the other surface of the semiconductor substrate 22 is made a light incidence face. The imaging element has pixels for rendering only light having a specific wavelength or more to photoelectric conversion by adjusting a pn junction depth h2 (h2r, h2g, h2b) between the photoelectric conversion element PD and an accumulation layer 18 on the light incidence face side. Further, the camera module includes the solid-state imaging element, and the electronic equipment module are also included. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
