Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure

摘要

A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4 , which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount of water contained in the solder layer 4 is 100 mul/g or less when represented by the amount of water vapor in standard conditions.