发明名称 EQUIPMENT AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP
摘要 PROBLEM TO BE SOLVED: To provide mounting equipment in which a spacer chip can be easily positioned between memory chips being stacked. SOLUTION: The mounting equipment comprises a first component feeding section 11 for feeding a memory chip 2, a second component feeding section 12 for sequentially feeding a spacer chip 3, a head 25 for mounting the memory chip and the spacer chip on a substrate 1, second image pick-up cameras 23A and 23B for recognizing the position of the memory chip and the spacer chip, before being mounted on the substrate by means of the mounting head, and a controller 20 for controlling the mounting position of these chips based on positional recognition of each chip by the second image pick-up cameras. In the positional recognition of the spacer chip by the second image pick-up cameras, the X and Y coordinates at one corner of the spacer chip and X, Y coordinates at two points on one side in the vicinity of the corner are recognized, displacement amount of the corner is determined from the X, Y coordinates of the corner, and displacement amount in the rotational direction is determined from the X, Y coordinates of the two points. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006073814(A) 申请公布日期 2006.03.16
申请号 JP20040255786 申请日期 2004.09.02
申请人 SHIBAURA MECHATRONICS CORP 发明人 OKUYAMA YUTAKA
分类号 H01L25/18;H01L21/52;H01L25/065;H01L25/07 主分类号 H01L25/18
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