发明名称 |
Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation of capacitor layer |
摘要 |
To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method.
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申请公布号 |
US2006057420(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20050532717 |
申请日期 |
2005.09.29 |
申请人 |
YOKOTA TOSHIKO;MATSUNAGA TETSUHIRO;TAKAHASHI SUSUMU;MATSUSHIMA HIDEAKI;YAMAMOTO TAKUYA;DOBASHI MAKOTO |
发明人 |
YOKOTA TOSHIKO;MATSUNAGA TETSUHIRO;TAKAHASHI SUSUMU;MATSUSHIMA HIDEAKI;YAMAMOTO TAKUYA;DOBASHI MAKOTO |
分类号 |
C23C14/00;B32B15/20;G01K5/66;H01G4/33;H05K1/16 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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