发明名称 Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation of capacitor layer
摘要 To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method.
申请公布号 US2006057420(A1) 申请公布日期 2006.03.16
申请号 US20050532717 申请日期 2005.09.29
申请人 YOKOTA TOSHIKO;MATSUNAGA TETSUHIRO;TAKAHASHI SUSUMU;MATSUSHIMA HIDEAKI;YAMAMOTO TAKUYA;DOBASHI MAKOTO 发明人 YOKOTA TOSHIKO;MATSUNAGA TETSUHIRO;TAKAHASHI SUSUMU;MATSUSHIMA HIDEAKI;YAMAMOTO TAKUYA;DOBASHI MAKOTO
分类号 C23C14/00;B32B15/20;G01K5/66;H01G4/33;H05K1/16 主分类号 C23C14/00
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