Semiconductor device package connecting system, has two sets of bonding regions positioned along two guide lines and correspond to two sets of adjacent bonding pads at central region of die, respectively

摘要

The system has a set of bonding regions about a die region (130). Each bonding region corresponds to a designated one of a set of bonding pads of a die mounted in the die region. Two sets of the bonding regions are positioned along two guide lines and correspond to two sets of adjacent bonding pads at a central region of the die, respectively. A set of external terminals each connected to one of the set of bonding regions. Independent claims are also included for the following: (A) a semiconductor device package comprising a semiconductor device die and a connecting system (B) a method for wire bonding a semiconductor device package.