Surface acoustic wave device

摘要

A surface acoustic wave device is provided which includes interdigital electrodes mainly containing Cu and has significantly improved power resistance. A surface acoustic wave device 1 includes a piezoelectric substrate 2 and interdigital electrodes 3 formed thereon. The interdigital electrodes 3 each include a main electrode layer 3a formed of Cu or an alloy mainly containing Cu, and an adhesive layer 3b disposed between the main electrode layer 3a and the piezoelectric substrate 2 and mainly contains NiCr. Alternatively, the adhesive layer 3b mainly contains Ti and has a thickness of 18 to 60 nm.