| 摘要 |
PURPOSE: A semiconductor for preventing a bonding pad from being contaminated is provided to easily bond a metal pad of a chip to wire by avoiding contamination of the metal pad. CONSTITUTION: An oxide(200) is deposited on a metal pad. A nitride(100) is deposited on the oxide. Photoresist is formed on the nitride to open a metal pad portion. The nitride is etched. A predetermined portion of the oxide is etched. The non-etching portion of the oxide, a glue layer on the metal pad and a predetermined thickness of the metal pad are etched. |
