Equipment for heating and cooling substrates for coating photo resist thereto

摘要

Equipment for cooling semi-conductor substrates and printed circuit boards after coating photo resist thereon including heating the substrate for treatment. A heating block furnished with a heating plate is provided in a holding frame device on which the substrate is placed and is so mounted that the heating block can be elevated and lowered vertically therein. The heating block further includes a cooling block having a cooling plate which can be reciprocated from one open side of the holding frame device to the interior thereof, the cooling plate being vertically elevated and lowered in the holding frame equipment when the cooling block is in the holding frame device.