Hot-melt adhesive composition

摘要

The present invention is directed to a hot-melt adhesive containing at least one propylene/1-hexene copolymer. The adhesive contains an amount of a low viscosity, substantially crystalline wax, having a melting point of about 90 DEG C. to about 125 DEG C., sufficient to improve the elastic delamination resistance of the adhesive. The adhesives are particularly useful in disposible diaper construction.