发明名称 Printed wires arrangment for in-line memory (IMM) module
摘要 <p>The architecture has two arrays of memory devices located on respective sides of a printed circuit board (PCB) (419), where the devices of an array are arranged to overlap relative to a reference axis of the PCB. Vias are formed on the PCB, where the vias are parts of a path that connects input and output terminals of the devices. The vias are located relative to the axis inward from signal pads of the devices of the arrays.</p>
申请公布号 GB0602139(D0) 申请公布日期 2006.03.15
申请号 GB20060002139 申请日期 2006.02.02
申请人 SAMSUNG ELECTRONICS COMPANY LIMITED 发明人
分类号 主分类号
代理机构 代理人
主权项
地址