COOLING APPARATUS OF ELECTRIC DEVICE

摘要

Semiconductor elements ( 800 to 850 ) are obtained by molding IGBT and diodes to form an inverter for motor, each of which is in abutting contact with each of first cooling units ( 1100 to 1106 ). Semiconductor elements ( 860 to 910 ) are obtained by molding IGBT and diodes to form an inverter for generator, each of which is in abutting contact with each of the first cooling unit ( 1100 to 1106 ) and second cooling units ( 1200 to 1204 ). The heat value generated by the semiconductor elements ( 800 to 850 ) is larger than that generated by the semiconductor elements ( 860 to 910 ). A flow rate of a cooling water flowing through the first cooling units ( 1100 to 1106 ) is higher than that of the cooling water flowing through the second cooling units ( 1200 to 1204 )