发明名称 Memory module
摘要 The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector electrically couples the first circuit board to the second circuit board, such that the memory chip is electrically connected to the array of electrical contact points. Alternatively, The memory module that a rigid/flex circuit board. The rigid/flex circuit board includes a substantially rigid first section having at least one memory chip disposed thereon, and a substantially rigid second section having an array of electrical contact points disposed on a planar surface thereof. The rigid/flex circuit board also includes a flexible third section in-between the first section to the second section.
申请公布号 US7012812(B2) 申请公布日期 2006.03.14
申请号 US20040794766 申请日期 2004.03.04
申请人 RAMBUS, INC. 发明人 HABA BELGACEM
分类号 H05K1/11;G11C5/00;H01R12/04;H05K1/14;H05K1/18;H05K3/00 主分类号 H05K1/11
代理机构 代理人
主权项
地址