发明名称 Thermoplastic resin composition for electrical/electronic contact part and electrical/electronic contact part using the same
摘要 A thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes a thermoplastic resin and a polyol, wherein the polyol is contained in a range of 0.2 to 10 parts by weight based on 100 parts by weight of the thermoplastic resin. Alternatively, a thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes: a thermoplastic resin; a halogenated aromatic compound which is contained in a range of 1 to 50 parts by weight based on 100 parts by weight of the thermoplastic resin; and a double salt represented by at least one of (X<SUB>2</SUB>O)<SUB>n</SUB>.Sb<SUB>2</SUB>O<SUB>5 </SUB>and (YO)<SUB>n</SUB>.Sb<SUB>2</SUB>O<SUB>5</SUB>, where X represents a monovalent alkaline metal element, and Y represents a divalent alkaline earth metal element, and n represents a ratio of X<SUB>2</SUB>O or YO to Sb<SUB>2</SUB>O<SUB>5 </SUB>exceeding 0.7, the double salt having an adsorbed water elimination rate of not more than 50 min. as calculated in terms of titration time; or a polyol; wherein the double salt is contained in a range of 0.5 to 40 parts by weight based on 100 parts by weight of the thermoplastic resin.
申请公布号 US7012112(B2) 申请公布日期 2006.03.14
申请号 US20030406219 申请日期 2003.04.04
申请人 MITSUBISHI ENGINEERING PLASTICS CORPORATION 发明人 TAKENAKA YUTAKA;FUNAKI KENJI;FURUYA TOSHIYUKI;MURAMATSU SHIGERU;KANAZAWA YOSHITAKA;KIMURA OSAMU
分类号 C08K3/22;C08K5/053;C08L63/00;C08L67/02;C08L71/02;C08L101/00;H01H1/02;H01H1/021 主分类号 C08K3/22
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