发明名称 Method of forming a lamination film pattern and improved lamination film pattern
摘要 In a method of forming an electrically conductive lamination pattern, an insulating film is formed on a surface of a chromium-containing bottom layer, before an aluminum-containing top layer is formed over the insulating film, so that the insulating film separates the aluminum-containing top layer from the chromium-containing bottom layer. A first selective wet etching process is carried out for selectively etching the aluminum-containing top layer with a first etchant. A second selective wet etching process is carried out for selectively etching the chromium-containing bottom layer with a second etchant in the presence the insulating film which suppresses a hetero-metal-contact-potential-difference between the chromium-containing bottom layer and the aluminum-containing top layer during the second selective wet etching process.
申请公布号 US7012029(B2) 申请公布日期 2006.03.14
申请号 US20030745636 申请日期 2003.12.29
申请人 NEC LCD TECHNOLOGIES, LTD. 发明人 KATOH TSUYOSHI;KIDO SYUUSAKU;MAEDA AKITOSHI
分类号 G02F1/1343;H01L21/302;G02F1/1362;H01L21/28;H01L21/3205;H01L21/3213;H01L21/336;H01L21/768;H01L21/77;H01L21/84;H01L23/52;H01L23/532;H01L27/12;H01L29/786 主分类号 G02F1/1343
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