发明名称 |
Method and apparatus for polishing workpiece |
摘要 |
A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.
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申请公布号 |
US7011569(B2) |
申请公布日期 |
2006.03.14 |
申请号 |
US20020134513 |
申请日期 |
2002.04.30 |
申请人 |
EBARA CORPORATION |
发明人 |
SHIMIZU NOBURU;KIMURA NORIO |
分类号 |
B24B1/00;B08B1/04;B24B27/00;B24B37/04;H01L21/00;H01L21/306;H01L21/687 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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