Silicon wafer for probe bonding and Silicon wafer module for probe bonding and probe bonding method using thereof,申请号KR20040043676-传众专利搜索

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发明名称	Silicon wafer for probe bonding and Silicon wafer module for probe bonding and probe bonding method using thereof
摘要
申请公布号	KR100557201(B1)	申请公布日期	2006.03.10
申请号	KR20040043676	申请日期	2004.06.14
申请人		发明人
分类号	H01L21/66;G01R1/073;G01R3/00	主分类号	H01L21/66
代理机构		代理人
主权项
地址

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