| 摘要 |
A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component ( 30 A), with a solder bump electrode ( 31 ) containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X'), with an electrode section ( 21 ) corresponding to the solder bump electrode ( 31 ), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode ( 31 ) and the electrode section ( 21 ) by pressing the electronic component ( 30 A) against the wiring board (X'), with the solder bump electrodes ( 31 ) and the electrode sections ( 21 ) abutting against each other.
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