| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which gives extremely excellent adhesiveness when applied under conditions of 25 to 60% humidity without requiring burning, which is developable with low alkali intensity and can be developed while keeping high sensitivity and producing no residue, which can be patterned with a sharp outline and gives a hard resist film with improved scratch resistance for handling prior to development. <P>SOLUTION: The composition contains: (A) an alkali-soluble polymer substance having at least one carboxyl group in the molecule; (B) a photo-thermal conversion substance which absorbs IR rays of a development exposure light source into heat; and (C) a thiol compound. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
