发明名称 |
Semiconductor package and laminated semiconductor package |
摘要 |
A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.
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申请公布号 |
US2006049495(A1) |
申请公布日期 |
2006.03.09 |
申请号 |
US20050528160 |
申请日期 |
2005.03.17 |
申请人 |
NEC CORPORATION |
发明人 |
HAZEYAMA ICHIRO;SOGAWA YOSHIMICHI;YAMAZAKI TAKAO;KITAJO SAKAE |
分类号 |
H01L23/02;H01L23/12;H01L23/31;H01L23/538;H01L25/065;H01L25/07;H01L25/10;H01L25/18 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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