| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow the peripheral portion of a semiconductor substrate to be polished by an appropriate amount without causing a lack of polishing or excessive polishing. <P>SOLUTION: A substrate processing method is used to polish the peripheral portion of a semiconductor substrate 13. The substrate processing method comprises: a process of bringing the polishing surface of a polishing mechanism 20 into contact with the principal surface of the peripheral portion of the substrate 13, and pressing the polishing surface against the principal surface; a process of polishing the principal surface by rotating the substrate 13 with a motor 12, and detecting the polishing end point of the principal surface by monitoring the polished state of the principal surface; a process of stopping polishing of the principal surface when the polishing end point is detected, and determining the polishing time for a surface other than the principal surface, which is to be polished subsequently, on the basis of the polishing time for the principal surface which is determined when polishing is finished; and a process of polishing the surface for the determined polishing time. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
