| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device for efficiently and reliably performing electric connection between a surface acoustic wave chip and its circumference, and to provide its manufacturing method. <P>SOLUTION: The surface acoustic wave device 30 includes the surface acoustic wave chip 31 with an interdigital transducer 33 formed on one surface of a piezoelectric board; and a package 40 for airtightly storing the surface acoustic wave chip. The surface acoustic wave chip includes a lead out electrode 35 integrated with the interdigital transducer; and an electrode pad 36 to be connected to the lead out electrode. The electrode pad 36 includes a first metallic layer 51 to be an electrode surface; and a second metallic layer 52 for raising tight adhesion in the first metallic layer 51. The lead out electrode is arranged to go around to the front surface side of the first metallic layer of the electrode pad. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
