| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding apparatus which can mold a resin while preventing resin unpacking and void occurrence by making a resin flow in a cavity be balanced well. SOLUTION: In the resin molding apparatus for molding the resin by clamping an article 10 to be molded by an upper mold 20 and a lower mold 30 and packing the resin from a pot 32 into cavities 24a and 24b, gate pieces 25a, 25b, 35a, and 35b movable in the mold opening/closing direction are set at positions adjacent to the cavities 24a and 24b of the upper mold 20 and the lower mold 30, and gate piece moving means 27a, 27b, 37a, and 37b which regulate the positions in the mold opening/closing direction of the gate pieces set in the upper mold 20 and the lower mold 30 and the spaces between the contact end surfaces of the gate pieces are set. COPYRIGHT: (C)2006,JPO&NCIPI |
