发明名称 METHOD FOR ELECTROLYTIC DEPOSITION OF METAL
摘要 PROBLEM TO BE SOLVED: To provide a method as well as an electrolyte for the electrolytic deposition of a mat or half-glossy copper layer from an acid electrolyte on a matrix such as metallic plastics in a pull-through device. SOLUTION: The method according to this invention is operated with current densities between 10 and 100 A/dm<SP>2</SP>and electrolyte temperatures between 22 to 60°C and is suitable for depositing the mat or half-glossy copper layer in the high-speed pull-through device. The electrolyte comprises at least copper, an alkyl sulfonic acid, halide ions, an ethoxylate and a naphthalene condensation product. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006063450(A) 申请公布日期 2006.03.09
申请号 JP20050243009 申请日期 2005.08.24
申请人 ENTHONE INC 发明人 VAN WIJNGAARDEN CHRISTEL;SCHOTTLE MARCO;KLEINFELD MARLIES;HEYER JOACHIM
分类号 C25D3/38;C25D7/04;C25D7/06 主分类号 C25D3/38
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