发明名称 THERMALLY DEVELOPABLE MATERIALS WITH BACKSIDE CONDUCTIVE LAYER
摘要 <p>Thermally developable materials that comprise a support have a conductive backside layer that has increased conductive efficiency. Conductivity is provided by non acicular metal antimonate particles that are present in an amount greater than 55 and up to 85 dry weight % at a coverage of from 0.06 to 0.5 g/m2, and the ratio of total binder polymers in the backside conductive layer to the non-acicular metal antimonate particles is less than 0.75:1 (dry weights). The level of conductive particles is reduced from previous uses without an unacceptable loss in conductivity. In addition, the dry thickness of the conductive layer is considerably reduced.</p>
申请公布号 WO2006026146(A1) 申请公布日期 2006.03.09
申请号 WO2005US29042 申请日期 2005.08.16
申请人 EASTMAN KODAK COMPANY;LUDEMANN, THOMAS, JAY;LABELLE, GARY, ELZEAR;KOESTNER, ROLAND, JOHN;HEFLEY, JOHN;BHAVE, APARNA, VASANT;GEISLER, THOMAS, CHARLES;PHILIP, DARLENE, FAYE 发明人 LUDEMANN, THOMAS, JAY;LABELLE, GARY, ELZEAR;KOESTNER, ROLAND, JOHN;HEFLEY, JOHN;BHAVE, APARNA, VASANT;GEISLER, THOMAS, CHARLES;PHILIP, DARLENE, FAYE
分类号 G03C1/498;B41M5/32;B41M5/40 主分类号 G03C1/498
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