发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 <p>A thermoplastic resin composition which is accelerated in the crystallization in molding and has an excellent heat distortion temperature and high rigidity and which can give moldings of excellent appearance little suffering surface delamination and are favorably usable for working parts of automobiles or electrical or electronic appliances. This composition comprises 100 parts by weight of a polyamide resin (A) constituted of the following constituent units (1) and (2) and 5 to 100 parts by weight of a liquid crystal polyester-amide resin (B): (1) constituent units derived from diamine which consist of constituent units derived from a straight-chain C&lt;SUB&gt;4-12&lt;/SUB&gt; aliphatic diamine and/or constituent units derived from a C&lt;SUB&gt;4-12&lt;/SUB&gt; aliphatic diamine having a side chain, and (2) constituent units derived from dicarboxylic acid which consist of 40 to 100% by mole of constituent units derived from terephthalic acid and 0 to 60% by mole of constituent units derived from isophthalic acid.</p>
申请公布号 WO2006025538(A1) 申请公布日期 2006.03.09
申请号 WO2005JP16153 申请日期 2005.08.29
申请人 POLYPLASTICS CO., LTD.;TAGUCHI, YOSHIAKI;KATSUMATA, TORU;SHIWAKU, TOSHIO 发明人 TAGUCHI, YOSHIAKI;KATSUMATA, TORU;SHIWAKU, TOSHIO
分类号 (IPC1-7):C08L77/06;C08L77:12;C08L77/06 主分类号 (IPC1-7):C08L77/06
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