SILICONE STRUCTURE MANUFACTURING METHOD, MOLD MANUFACTURING METHOD, SILICONE STRUCTURE, INK JET RECORDING HEAD, IMAGE FORMING APPARATUS AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a silicon structure manufacturing method capable of forming a fine structure with high precision, a mold manufacturing method, a silicone structure, an ink jet recording head, an image forming apparatus and a semiconductor device.

SOLUTION: Trench etching is applied to a silicon substrate having a patterned oxide film 114 formed thereon to form a groove 118 demarcated by a wall part 122. Further, the oxide film 114 is removed. Furthermore, a burr 121 formed to an upper part of the wall part 122 is removed by applying dry etching to the entire surface of the wall part.

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