发明名称 POLISHING LIQUID COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing liquid composition, providing small surface roughness of a substrate to be polished after polishing and remarkably reducing nonoscratches and also provide a method of manufacturing a substrate having small surface roughness and remarkably reduced nanoscratches. <P>SOLUTION: This polishing liquid composition containing polishing material and water satisfies the following conditions: (1) the filter liquid passing quantity of a bore diameter 0.5μm in a standard test A is 3.7 g/(min, cm<SP>2</SP>) or more; (2) the primary average particle diameter of polishing material is 50 nm or less; and (3) the content of polishing material 2 to 40 wt.%. The method of manufacturing the substrate uses the above polishing liquid composition in a finishing polishing process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006061995(A) 申请公布日期 2006.03.09
申请号 JP20040244068 申请日期 2004.08.24
申请人 KAO CORP 发明人 YOSHIDA HIROYUKI
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
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