| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is constructed in such a way that a second semiconductor chip is mounted on one surface of a first semiconductor chip via a die mount material and both semiconductor chips are sealed with a mold resin, and is devised to inhibit the bleed-out of the die mount material from spreading. <P>SOLUTION: The semiconductor device 100 is constructed in such a way that the second semiconductor chip 20 is mounted on one surface of the first semiconductor chip 10 via the die mount material 30, and both semiconductor chips 10, 20 are sealed with the mold resin 60. A groove 12 is formed on the outer periphery of the mounting area of the second semiconductor chip 20 on one surface of the first semiconductor chip 10 so as to surround the mounting area. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
