| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip IC module capable of suppressing signal transmission via grounding between IC chips. SOLUTION: In the module, ground connections of amplifier chips 12, 13 are connected to each other at the external connection point Q of a package 17 via a grounding frame 14 and a grounding pattern 22 (branch parts 22a, 22b). Consequently, a passage connecting the amplifier chips 12, 13 and the connection point Q is longer compared with prior art constitution (a passage connecting the ground connections of the amplifier chips 12, 13 (inter-chip grounding passage) is increased). In the module, an inductance component is therefore formed around the inter-chip grounding passage. It is possible to prevent high frequency signals from being transmitted via the ground connection of the amplifier chips 12, 13. COPYRIGHT: (C)2006,JPO&NCIPI
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